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 Datasheet, Rev. 1.0, June 2009
TLD5085EJ
1.8A DC/DC Step-Down Converter Infineon(R) Power LED Driver
Automotive Power
1.8A DC/DC Step-Down Converter
TLD5085EJ
1
* * * * * * * * * * * * *
Overview
Wide Input Voltage Range from 4.75V to 45V Constant Current or Constant Voltage Regulation Drives LEDs in Buck Topology Very low shutdown current consumption (typ. 0.1A) 370 kHz switching frequency PWM Dimming Integrated power-switch (output current up to 1.8A) Internal Soft-Start function 2% output current tolerance ( 4% for full load current range) Small thermally enhanced exposed heatslug package Over Temperature Shutdown AEC Qualified Green Product (RoHS Compliant)
PG-DSO-8-27
Description The TLD5085EJ is a smart LED buck converter with an integrated power-switch, capable of driving up to 1.8A load current with excellent line and load regulation. The main function of this device is to step-down the input voltage and regulating a constant LED current. The constant current regulation is especially beneficial for LED color accuracy and longer lifetime. The TLD5085EJ also has a PWM input which can be used for LED dimming. The switching frequency of 370kHz allows to use small and inexpensive passive components. An Enable function is implemented to reduce the shut-down current consumption to typ. 0.1A. This IC is suited for use in the harsh automotive environments and provides protection functions such as current limitation and overtemperature shutdown. The integrated soft-start feature avoids a current and voltage overshot at the output during start-up of the device. Applications * * * Automotive Lighting (Reading Light, Dome Light, Dashboard Backlighting) High Power LED Applications Constant Current and Voltage Source
Type TLD5085EJ Datasheet
Package PG-DSO-8-27 2
Marking TLD5085 Rev. 1.0, 2009-06-04
TLD5085EJ
Block Diagram
2
Block Diagram
7
EN
8
VS
Enable Charge Pump Over Temperature Shutdown Feedforward COMP
3
5
BDS
Buck Converter
Oscillator
6
BUO
PWMI
1
4
FB
Bandgap Reference
Soft start ramp generator
TLD5085
2
GND
Figure 1
Block Diagram
Datasheet
3
Rev. 1.0, 2009-06-04
TLD5085EJ
Pin Configuration
3
3.1
Pin Configuration
Pin Assignment
PWMI GND COMP FB
1 2 3
TLD5085
8 7 6
VS EN BUO BDS
EP 4
S08_Pinout _TLD5085 .vsd
5
Figure 2
Pin Configuration
3.2
Pin 1 2 3
Pin Definitions and Functions
Symbol Function PWMI GND PWM Input for; Provides LED dimming option. If not used connect to VS. Ground; Connect to system ground. Compensation Input; Frequency compensation for regulation loop stability. Connect R and C network to pin for stability. Feedback Input; Connect a defined power resistor (RFB=0.6V/ILED) to get the needed LED output current. For adjustable output voltages connect this pin via a voltage divider in parallel to the output capacitor. Buck Driver Supply Input; Connect the bootstrap capacitor between this pin and pin BUO. Buck Switch Output; Source of the integrated power-switch. Connect directly to the cathode of external freewheeling diode and the buck circuit inductance. Enable Input; Apply logic high signal to enable the device. A pull down resistor is integrated. Supply Voltage Input; Connect to supply voltage source. Exposed Pad; Connect to heatsink area and GND by low inductance wiring.
COMP
4
FB
5 6
BDS BUO
7 8 EP
EN VS
Datasheet
4
Rev. 1.0, 2009-06-04
TLD5085EJ
General Product Characteristics
4
4.1
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings 1)
Tj = -40 C to +150 C; all voltages with respect to ground (unless otherwise specified)
Pos. Voltages 4.1.1 4.1.2 4.1.3 4.1.4 4.1.5 4.1.6 4.1.7 4.1.8 PWMI (Pin1) PWM Input COMP (Pin 3) Compensation Input FB (Pin 4) Feedback Input BDS (Pin 5) Buck Driver Supply Input BUO (Pin 6) Buck Switch Output EN (Pin 7) Enable Input VS (Pin 8) Supply Voltage Input Junction Temperature Storage Temperature ESD Resistivity all Pins to GND Parameter Symbol Limit Values Min. Max. 45 5.5 6.2 5.5 V V V V V V V V - - Unit Conditions
VPWMI VCOMP VFB VBDS VBUO VEN VS
-0.3 -0.3 -0.3
t < 10s2)
- - - - -
VBUO
- 0.3 -2.0 -40 -0.3
VBUO
+ 5.5
VVS + 0.3
45 45
Temperatures 4.1.9 4.1.10 4.1.11
Tj Tstg VESD
-40 -55 -2
150 150 2
C C kV
- - HBM 3)
ESD Susceptibility
1) Not subject to production test, specified by design 2) Exposure to those absolute maximum ratings for extended periods of time (t > 10s) may affect device reliability 3) ESD susceptibility HBM according to EIA/JESD 22-A 114B (1.5k,100pF).
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous repetitive operation.
Datasheet
5
Rev. 1.0, 2009-06-04
TLD5085EJ
General Product Characteristics
4.2
Pos. 4.2.1 4.2.2 4.2.3 4.2.4 4.2.5 4.2.6
Functional Range
Parameter Supply Voltage Output Voltage adjust range External buck inductor External buck capacitor External buck capacitor ESR Junction Temperature Symbol Min. Limit Values Max. 45 16 56 120 0.3 150 V V H F C - see Figure 5 see Figure 5 and Figure 6 - 1) - 4.75 0.60 18 33 - -40 Unit Conditions
VS VCC LBU CBU1 ESRBU1 Tj
1) See section ""Application Information" on Page 11" for loop compensation requirements.
Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table.
4.3
Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Pos. 4.3.1 4.3.2 Parameter Junction to Case Junction to Ambient (2s2p) Symbol Min. Limit Values Typ. - 42 Max. 10 - K/W K/W
1) 2) 1) 3)
Unit
Conditions
RthJC RthJA
- -
1) Not subject to production test, specified by design. 2) Specified RthJC value is simulated at natural convection on a cold plate setup (all pins and the exposed pad are fixed to ambient temperature). Ta=25C, power-switch is dissipating 1W. 3) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70m Cu, 2 x 35m Cu). According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25C, powerswitch is dissipating 1W.
Datasheet
6
Rev. 1.0, 2009-06-04
TLD5085EJ
Buck Regulator
5
5.1
Buck Regulator
Description
The gate of the power-switch is driven by the Gate driver which is supplied by the external capacitor connected to pin BDS (Buck Driver Supply) using the bootstrap principle. BDS is the supply pin for the integrated gate driver of the internal power-switch. The power-switch has to be in the RDSon region. If VGS is not high enough, the power-switch can not operate in the RDSON region, which means high power dissipation. An integrated under voltage lockout function (BDS UV-Comparator) supervising the 'bootstrap' capacitor voltage ensures that the device is always driven with a sufficient bootstrap voltage in order to prevent from extensive heat up of the power-switch. An integrated charge pump supports the gate driver in case of low input supply voltage, small differential voltage between input supply and output voltage at low current and during startup. In order to minimize emission, the charge pump is switched off if the input voltage is sufficient for supplying the bootstrap. The soft start function generates a defined ramp of the reference voltage during the first 0.5 ms (typ.) after device initialization and if the Device is autorestarting after a thermal shutdown. This function is disabled during the dimming operation via the PWMI-pin.
VS
8
COMP
3
Overcurrent Comp.
Charge Pump BDS Charger
5
BDS
Clock
Feedback Error Amp.
Soft Start Ramp
=
VREF =0.6V
2
GND
Figure 3
Block Diagram Buck Regulator
Datasheet
+
PWM Comp.
FB
4
Gate Driver
Logic
Power Switch
Ramp Generator
6 Temp. Sensor
BDS UV Comp.
BUO
1
PWMI
7
Rev. 1.0, 2009-06-04
TLD5085EJ
Buck Regulator
5.2
Electrical Characteristics
Electrical Characteristics: Buck Regulator
VS = 6.0 V to 40 V, Tj = -40 C to +150 C, all voltages with respect to ground (unless otherwise specified)
Pos. 5.2.1 Parameter FB input voltage Symbol Limit Values Min. Typ. Max. 0.612 V 0.588 0.60 Unit Conditions
VFB
5.2.2
VFB
FB input current Power-Switch on-resistance Current transition rise/fall time Buck peak over current limit Bootstrap under voltage lockout, turn-off threshold Charge pump current Charge pump switch-off threshold Maximum duty cycle Soft start ramp Input under voltage shutdown threshold Input voltage startup threshold Input under voltage shutdown hysteresis
0.576 0.60
0.624
V
5.2.3 5.2.4 5.2.5 5.2.6 5.2.7 5.2.8 5.2.9 5.2.10 5.2.11 5.2.12 5.2.13 5.2.14
IFB RDS(ON) tr IBUOC VBDS,off ICP VBDS VBUO Dmax tstart VS,off VS,on VS,hyst
-1 - - 2.2 +3.3 2 - - 350 3.75 - 150
-0.1 - 50 -
0 500 - 3.6 - - 5 100 750 - 4.75 -
A m ns A V mA V % s V V mV
VEN = VS; VS = 12V 0.1A < ICC < 1.0A VEN = VS; VS = 12V 1mA < ICC < 1.8A VFB = 0.6V ICC=300 mA; TJ = 150 C max. ICC=1 A 1)
- Bootstrap voltage decreasing
VBUO -
- - - 500 - - -
VS = 12V; VBUO = VBDS = GND (VBDS - VBUO) increasing
1) 2)
VFB rising from 5% to 95% of VFB,nom VS decreasing VS increasing
1)
1) Not subject to production test; specified by design. 2) Consider "Chapter 4.2, Functional Range"
Datasheet
8
Rev. 1.0, 2009-06-04
TLD5085EJ
Enable, Thermal Shutdown and PWM Dimming Function
6
6.1
Enable, Thermal Shutdown and PWM Dimming Function
Description
Enable Function: With the enable pin (EN) the device can be set in off-state reducing the current consumption to typ. 0.1A. The enable function features an integrated pull down resistor which ensures that the IC is shut down and the power-switch is off in case the pin EN is not connected. Device Wake Up Behavior: The device initialization is triggered either by the EN voltage level crossing the turnon threshold, rising supply voltage (during EN=H), and also when the device restarts after a thermal shutdown. The softstart ramp starts after the BDS external capacitor is charged. Overtemperature Behavior: The integrated thermal shutdown function turns the power-switch off in case of overtemperature. The typ. junction shutdown temperature is 175C, with a min. of 150C. After cooling down the IC will automatically restart operation. The thermal shutdown is an integrated protection function designed to prevent IC destruction when operating under fault conditions. It must not be used for normal operation. PWM Dimming Function: The PWMI signal directly controls the gate driver of the integrated power-switch by overriding the internal control signals.
6.2
Electrical Characteristics Enable, Bias, Thermal Shutdown and PWM Dimming
Electrical Characteristics: Enable, Bias and Thermal Shutdown
VS = 6.0 V to 40 V, Tj = -40 C to +150 C, all voltages with respect to ground (unless otherwise specified)
Pos. 6.2.1 Parameter Current Consumption, shut down mode Current Consumption, active mode Current Consumption, active mode Enable high signal valid Enable low signal valid Symbol Min. Limit Values Typ. 0.1 Max. 2 A - Unit Conditions
Iq,OFF
VEN = 0.8V; Tj < 105C; VS = 16V
1)
6.2.2 6.2.3
Iq,ON Iq,ON
- -
- -
7 10
mA mA
VEN = 5.0V; ICC = 0mA; VS = 16V VEN = 5.0V; ICC = 1.8A; VS = 16V
1)
6.2.4 6.2.5 6.2.6 6.2.7 6.2.8 6.2.9 6.2.10 6.2.11 6.2.12 6.2.13 6.2.14
VEN,hi VEN,lo Enable hysteresis VEN,HY Enable high input current IEN,hi Enable low input current IEN,lo PWMI high threshold VPWMI,hi PWMI low threshold VPWMI,lo PWMI turn-on delay tPWM,ON PWMI turn-off delay tPWM,OFF Over temperature shutdown Tj,sd Over temperature shutdown Tj,sd_hyst
hysteresis
3 - 50 - - 3 - - - 150 -
- - 200 - 0.1 - - - - 175 15
- 0.8 400 30 1 - 0.8 5 5 190 -
V V mV A A V V s s C K
- -
1)
VEN = 16V VEN = 0.5V
- -
2)
-
1) 1)
1) Specified by design. Not subject to production test. 2) At startup current flowing in CBU1, recommended max. PWM frequency 1kHz@370kHz fsw
Datasheet
9
Rev. 1.0, 2009-06-04
TLD5085EJ
Oscillator
7
7.1
Oscillator
Description
The oscillator turns on the power-switch with a constant frequency while the buck regulating circuit turns the power-switch off in every cycle with an appropriate time gap depending on the output and input voltage. The internal sawtooth signal used for the PWM generation has an amplitude proportional to the input supply voltage (feedforward).
7.2
Electrical Characteristics Oscillator
Electrical Characteristics: Buck Regulator
VS = 6.0 V to 40 V, Tj = -40 C to +150 C, all voltages with respect to ground (unless otherwise specified)
Pos. 7.2.1 Parameter Oscillator frequency Symbol Min. Limit Values Typ. 370 Max. 420 kHz - 330 Unit Conditions
fosc
Datasheet
10
Rev. 1.0, 2009-06-04
TLD5085EJ
Application Information
8
Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.
8.1
Frequency Compensation
The stability of the output voltage can be achieved with a simple RC connected between pin COMP and GND. The standard configuration using the switching frequency of the internal oscillator is a ceramic capacitor CCOMP = 22nF and RCOMP = 22k. By slight modifications to the compensation network the stability can be optimized for different types of buck capacitors (ceramic or tantalum). The compensation network is essential for the control loop stability. Leaving pin COMP open might lead to an instable operation.
8.2
Compensating a tantalum buck capacitor CBU1
The TLD5085EJ control loop is optimized for ceramic buck capacitors CBU. In order to maintain stability also for tantalum capacitors with ESR up to 300m, an additional compensation capacitance CCOMP2 at pin COMP to GND is required. It's value calculates:
CCOMP2 = CBU * ESR(CBU) / RCOMP ,
whereas CCOMP2 needs to stay below 5nF.
Application _C-COMP2.vsd
COMP
3
TLD5085
CCOMP CCOMP2 RCOMP
2
GND
Figure 4
High-ESR buck capacitor compensation
8.3
Freewheeling Diode
In order to minimize losses and for fast recovery, a schottky freewheeling diode is required. Disconnecting the freewheeling diode during operation might lead to destruction of the IC.
Datasheet
11
Rev. 1.0, 2009-06-04
TLD5085EJ
Application Information
8.4
Constant Output Voltage Mode for LED applications
VBatt DRV C1
L1 C2 CS
8
VS
TLD5085
Cbootstrap BDS
5
LBU
Ignition Key Terminal 15 PWM Dimming
7
EN PWMI
BUO
6
1
DBU R1
R balance1
R balance2
CBU1
CBU2
3
COMP GND
2
FB
4
VCC
CCOMP RCOMP
Optional Parts
VFB
R2
SPIDER-LS
TLE7240 SL
Figure 5
Application Diagram (constant voltage mode)
Note: This is a very simplified example of an application circuit. The function must be verified in the real application The output voltage of the TLD5085EJ can be programmed by a voltage divider connected to the feedback pin FB. The divider cross current should be 300 A at minimum, therefore the maximum R2 calculates:
R2 VFB / IR2 --> R2 0.6V / 300 A = 2 k
For the desired output voltage level VCC, R1 calculates then (neglecting the small FB input current): V CC R 1 = R 2 --------- - 1 . V -
FB
Datasheet
12
Rev. 1.0, 2009-06-04
TLD5085EJ
Application Information
8.5
Constant current mode for LED applications
VBatt DRV C1
L1 C2 CS
8
VS
TLD5085
Cbootstrap BDS
5
LBU
Ignition Key Terminal 15 PWM Dimming
7
EN PWMI
BUO
6
1
DBU
CBU1
2 x High Brightness White LEDs
3
COMP GND
2
FB
4
CCOMP RCOMP
Optional Parts
RFB =
0.6V I LED
Figure 6
Application Diagram TLD5085 as LED Driver (constant current mode)
Note: This is a very simplified example of an application circuit. The function must be verified in the real application.
Datasheet
13
Rev. 1.0, 2009-06-04
TLD5085EJ
Package Outlines
9
Package Outlines
0.35 x 45 3.9 0.11)
Stand Off (1.45)
1.7 MAX.
0.1 C D 2x
0.19 +0.06
0.08 C Seating Plane
0.1+0 -0.1
1.27 0.410.09 2) 0.2
C
0.64 0.25
D 6 0.2 0.2
8 MAX.
M
M
C A-B D 8x
D 8x
Bottom View A
8 5
3 0.2
1 4
1
4
8
5
B 4.9 0.11)
Index Marking
0.1 C A-B 2x
1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width 3) JEDEC reference MS-012 variation BA
Figure 7 Outline PG-DSO-8-27
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).
For further package information, please visit our website: http://www.infineon.com/packages. Datasheet 14
2.65 0.2
PG-DSO-8-27-PO V01
Dimensions in mm Rev. 1.0, 2009-06-04
TLD5085EJ
Revision History
10
Version Rev. 1.0
Revision History
Date Changes
2009-06-04 Initial Datasheet for TLD5085EJ
Datasheet
15
Rev. 1.0, 2009-06-04
Edition 2009-06-04 Published by Infineon Technologies AG 81726 Munich, Germany (c) 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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